DocumentCode
2176067
Title
Characteristics of the resonance and impedance of power-bus structure with the embedded metamaterial substrate
Author
Kahng, Sungtek
Author_Institution
Univ. of Incheon, Incheon, South Korea
fYear
2008
fDate
10-12 Dec. 2008
Firstpage
16
Lastpage
19
Abstract
This paper conducts the research on the variation in the characteristics of the resonance and impedance of the metallic parallel plates due to the replacement of the normal dielectric substrate by the metamaterial. The ENG(¿<0), MNG(¿<0) and DNG(¿, ¿<0) types of metamaterial as well as the DPS(Double Positive) material are taken into consideration a full-wave modal analysis method known for accurate computation, as the SRR-kind of Lorentz model for permittivity and metal wire-periodic array-kind of Drude model for permeability, and the behaviors of parallel plates¿ resonance mode and impedance are observed. Based upon the observation, the design guidelines for the substrate can be addressed regarding how to suppress the parallel plates¿ spurious resonance modes that degrade the quality of the electronic equipment.
Keywords
computational electromagnetics; electric impedance; magnetic permeability; metamaterials; modal analysis; permittivity; resonance; waveguide components; DNG metamaterial; Drude model; ENG metamaterial; Lorentz model; MNG metamaterial; double positive material; embedded metamaterial substrate; full-wave modal analysis; impedance characteristic; metal wire-periodic array-kind; metallic parallel plates; permeability; permittivity; power-bus structure; resonance characteristic; Concurrent computing; Conducting materials; Dielectric materials; Dielectric substrates; Impedance; Inorganic materials; Metamaterials; Modal analysis; Permittivity; Resonance; DNG; Drude Model; ENG; Lorentz Model; MNG; Metamaterial; Parallel Plates; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location
Seoul
Print_ISBN
978-1-4244-2633-1
Electronic_ISBN
978-1-4244-2634-8
Type
conf
DOI
10.1109/EDAPS.2008.4735987
Filename
4735987
Link To Document