• DocumentCode
    2176067
  • Title

    Characteristics of the resonance and impedance of power-bus structure with the embedded metamaterial substrate

  • Author

    Kahng, Sungtek

  • Author_Institution
    Univ. of Incheon, Incheon, South Korea
  • fYear
    2008
  • fDate
    10-12 Dec. 2008
  • Firstpage
    16
  • Lastpage
    19
  • Abstract
    This paper conducts the research on the variation in the characteristics of the resonance and impedance of the metallic parallel plates due to the replacement of the normal dielectric substrate by the metamaterial. The ENG(¿<0), MNG(¿<0) and DNG(¿, ¿<0) types of metamaterial as well as the DPS(Double Positive) material are taken into consideration a full-wave modal analysis method known for accurate computation, as the SRR-kind of Lorentz model for permittivity and metal wire-periodic array-kind of Drude model for permeability, and the behaviors of parallel plates¿ resonance mode and impedance are observed. Based upon the observation, the design guidelines for the substrate can be addressed regarding how to suppress the parallel plates¿ spurious resonance modes that degrade the quality of the electronic equipment.
  • Keywords
    computational electromagnetics; electric impedance; magnetic permeability; metamaterials; modal analysis; permittivity; resonance; waveguide components; DNG metamaterial; Drude model; ENG metamaterial; Lorentz model; MNG metamaterial; double positive material; embedded metamaterial substrate; full-wave modal analysis; impedance characteristic; metal wire-periodic array-kind; metallic parallel plates; permeability; permittivity; power-bus structure; resonance characteristic; Concurrent computing; Conducting materials; Dielectric materials; Dielectric substrates; Impedance; Inorganic materials; Metamaterials; Modal analysis; Permittivity; Resonance; DNG; Drude Model; ENG; Lorentz Model; MNG; Metamaterial; Parallel Plates; Resonance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-2633-1
  • Electronic_ISBN
    978-1-4244-2634-8
  • Type

    conf

  • DOI
    10.1109/EDAPS.2008.4735987
  • Filename
    4735987