• DocumentCode
    2176110
  • Title

    A frequency tunable resonant clock distribution scheme using bond-wire inductor

  • Author

    Lee, Woojin ; Pak, Jiwoo ; Jiwoo Pak ; Ryu, Chunghyun ; Park, Jongbae ; Kim, Joungho

  • Author_Institution
    Dept. of EECS, Terahertz Interconnection & Package Lab., Daejeon, South Korea
  • fYear
    2008
  • fDate
    10-12 Dec. 2008
  • Firstpage
    24
  • Lastpage
    26
  • Abstract
    In this paper, we propose a frequency control method for a resonant clock distribution scheme using a bond-wire inductor. The resonant clock distribution using the embedded planes in a package and an inductive load suppresses the clock source jitter and significantly reduces the clock skew by replacing the cascaded repeaters of a conventional on-chip clock distribution. The resonant frequency can be controlled by the inductance of the load and the size of cavity planes. We use a bond-wire inductor instead of a chip inductor for fine tuning of resonant frequency and reducing the parasitic capacitance of integration. We have successfully demonstrated a 1.35 GHz clock delivery network with the transmission line matrix model of the plane cavity and the lumped model of bond-wire inductor. The simulation results show that the source jitter is suppressed by the resonance effect and the skew is minimized and the frequency is controlled by the inductance of a bond wire.
  • Keywords
    circuit tuning; clocks; frequency control; inductors; jitter; transmission line matrix methods; bond-wire inductor; clock skew; clock source jitter; frequency 1.35 GHz; frequency control method; frequency tunable resonant clock distribution; transmission line matrix; Bonding; Clocks; Frequency control; Inductance; Inductors; Jitter; Packaging; Resonance; Resonant frequency; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-2633-1
  • Electronic_ISBN
    978-1-4244-2634-8
  • Type

    conf

  • DOI
    10.1109/EDAPS.2008.4735989
  • Filename
    4735989