Title :
Using of thermoelectric modules for heat exchange intensification
Author :
Takhistov, Philip Yu
Author_Institution :
Found. "FRETE", St. Petersburg, Russia
Abstract :
Nowadays thermoelectric modules (TEM) are widely used for the cooling of different electronic devices, i.e. computer processors. Application of thermoelectric modules allows one to obtain an additional drop of object temperature. The effectiveness of a computer processor cooling system with Peltier modules depends on various factors-heat released by the processor, type of thermoelectric module, thermal resistance of cooler, power supply parameters, etc. Regarding these factors, recommendations on choosing and applying modules for computer processor cooling are given
Keywords :
Peltier effect; cooling; heat sinks; microprocessor chips; thermal analysis; thermoelectric devices; Peltier modules; application recommendations; computer processor cooling; heat exchange intensification; heat release; object temperature; power supply parameters; selection recommendations; thermal resistance; thermoelectric modules; Electric resistance; Electronics cooling; Heat sinks; Temperature; Thermal conductivity; Thermal factors; Thermal resistance; Thermoelectric devices; Thermoelectricity; Voltage;
Conference_Titel :
Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-7205-0
DOI :
10.1109/ICT.2001.979931
