Using of thermoelectric modules for heat exchange intensification

Author

Takhistov, Philip Yu

Author_Institution

Found. "FRETE", St. Petersburg, Russia

fYear

2001

fDate

2001

Firstpage

467

Lastpage

469

Abstract

Nowadays thermoelectric modules (TEM) are widely used for the cooling of different electronic devices, i.e. computer processors. Application of thermoelectric modules allows one to obtain an additional drop of object temperature. The effectiveness of a computer processor cooling system with Peltier modules depends on various factors-heat released by the processor, type of thermoelectric module, thermal resistance of cooler, power supply parameters, etc. Regarding these factors, recommendations on choosing and applying modules for computer processor cooling are given

Keywords

Peltier effect; cooling; heat sinks; microprocessor chips; thermal analysis; thermoelectric devices; Peltier modules; application recommendations; computer processor cooling; heat exchange intensification; heat release; object temperature; power supply parameters; selection recommendations; thermal resistance; thermoelectric modules; Electric resistance; Electronics cooling; Heat sinks; Temperature; Thermal conductivity; Thermal factors; Thermal resistance; Thermoelectric devices; Thermoelectricity; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on

Conference_Location

Beijing

ISSN

1094-2734

Print_ISBN

0-7803-7205-0

Type

conf

DOI

10.1109/ICT.2001.979931

Filename

979931