360 PPI Flip-Chip Mounted Active Matrix Addressable Light Emitting Diode on Silicon (LEDoS) Micro-Displays

Author

Zhao Jun Liu ; Wing Cheung Chong ; Ka Ming Wong ; Kei May Lau

Author_Institution

Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China

Volume

9

Issue

8

fYear

2013

fDate

Aug. 2013

Firstpage

678

Lastpage

682

Abstract

In this paper, we describe the design and fabrication of 360 PPI flip-chip mounted active matrix (AM) addressable light emitting diode on silicon (LEDoS) micro-displays. The LEDoS micro-displays are self-emitting devices which have higher light efficiency than liquid crystal based displays (LCDs) and longer lifetime than organic light emitting diodes (OLEDs) based displays . The LEDoS micro-displays were realized by integrating monolithic LED micro-arrays and silicon-based integrated circuit using a flip-chip bonding technique. The active matrix driving scheme was designed on the silicon to provide sufficient driving current and individual controllability of each LED pixel. Red, green, blue and Ultraviolet (UV) LEDoS micro-displays with a pixel size of 50 μm and pixel pitch of 70 μm were demonstrated. With a peripheral driving board, the LEDoS micro-display panels were programmed to show representative images and animations.

Keywords

LED displays; flip-chip devices; liquid crystal displays; organic light emitting diodes; silicon; 360 PPI flip-chip mounted active matrix; AM; LCD; LEDoS microdisplay; OLED; Si; active matrix driving scheme; flip-chip bonding technique; liquid crystal based displays; monolithic LED microarray; organic light emitting diodes; peripheral driving board; pixel pitch; self-emitting devices; silicon microdisplay; silicon-based integrated circuit; size 70 mum; ultraviolet LEDoS microdisplay; Educational institutions; Fabrication; Image color analysis; Light emitting diodes; Silicon; Substrates; Transistors; Active circuits; displays; flip chip; light emitting diodes (LED);

fLanguage

English

Journal_Title

Display Technology, Journal of

Publisher

ieee

ISSN

1551-319X

Type

jour

DOI

10.1109/JDT.2013.2256107

Filename

6502265