Title :
A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package
Author :
Kaneko, Satoshi ; Takahahsi, Yo ; Sudo, Toshio ; Kanno, Akihiro ; Sugimmoto, Akiko ; Kuwako, Fujio
Author_Institution :
Shibaura Inst. of Technol., Tokyo, Japan
Abstract :
Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 ¿F in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high-density thin-film decoupling capacitance inside the package.
Keywords :
broadband networks; buffer circuits; circuit noise; electronics packaging; laminates; programmable logic devices; thin film capacitors; CPLD; broadband switching noise reduction; capacitance 1 muF; complex programmable logic device; evaluation board; high-density thin-film capacitor; high-density thin-film decoupling capacitance; laminate package; mounted package; noise generating circuits; output buffer circuits; Capacitors; Circuit noise; Laminates; Noise generators; Noise reduction; Packaging; Programmable logic devices; Switching circuits; Thin film circuits; Transistors;
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
DOI :
10.1109/EDAPS.2008.4736002
