• DocumentCode
    2176588
  • Title

    Partial EBG placement on PDN to effectively suppress simultaneous switching noise

  • Author

    Kwon, Jong Hwa ; Sim, Dong Uk ; Kwak, Sang Il ; Yun, Jae Hoon ; Yook, Jong Gwan

  • Author_Institution
    Radio Technol. Group, Electron. & Telecommun. Res. Inst., South Korea
  • fYear
    2008
  • fDate
    10-12 Dec. 2008
  • Firstpage
    89
  • Lastpage
    92
  • Abstract
    To build a stable power distribution network (PDN) in high-speed digital systems, the simultaneous switching noise (SSN) should be sufficiently suppressed. In view of the results of recent research, the uni-planar compact electromagnetic bandgap (UC-EBG) structure is regarded as a promising solution to cope with the SSN problems until the GHz frequency ranges. However, if UC-EBG is adopted for the power/ground plane in the multilayer PCB/package structures, problems of signal integrity may result from the high speed signals passing over the EBG patterns because of the discontinuities of the etched reference plane. In this paper, the partial placement of EBG unit cells only near the sources of noise and/or the noise sensitive components is proposed as a means of both suppressing the noise propagation and minimizing the effects of a discontinuous reference plane. The SSN suppression performance of the proposed structure is validated and investigated both numerically and experimentally.
  • Keywords
    distribution networks; integrated circuit noise; integrated circuit packaging; multilayers; printed circuits; EBG unit cells; high-speed digital systems; multilayer PCB-package structures; partial EBG placement; power distribution network; reference plane; signal integrity; simultaneous switching noise; uniplanar compact electromagnetic bandgap structure; Circuit noise; Digital systems; Etching; Frequency; Metamaterials; Nonhomogeneous media; Packaging; Periodic structures; Power systems; Telecommunication switching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-2633-1
  • Electronic_ISBN
    978-1-4244-2634-8
  • Type

    conf

  • DOI
    10.1109/EDAPS.2008.4736006
  • Filename
    4736006