DocumentCode :
2176588
Title :
Partial EBG placement on PDN to effectively suppress simultaneous switching noise
Author :
Kwon, Jong Hwa ; Sim, Dong Uk ; Kwak, Sang Il ; Yun, Jae Hoon ; Yook, Jong Gwan
Author_Institution :
Radio Technol. Group, Electron. & Telecommun. Res. Inst., South Korea
fYear :
2008
fDate :
10-12 Dec. 2008
Firstpage :
89
Lastpage :
92
Abstract :
To build a stable power distribution network (PDN) in high-speed digital systems, the simultaneous switching noise (SSN) should be sufficiently suppressed. In view of the results of recent research, the uni-planar compact electromagnetic bandgap (UC-EBG) structure is regarded as a promising solution to cope with the SSN problems until the GHz frequency ranges. However, if UC-EBG is adopted for the power/ground plane in the multilayer PCB/package structures, problems of signal integrity may result from the high speed signals passing over the EBG patterns because of the discontinuities of the etched reference plane. In this paper, the partial placement of EBG unit cells only near the sources of noise and/or the noise sensitive components is proposed as a means of both suppressing the noise propagation and minimizing the effects of a discontinuous reference plane. The SSN suppression performance of the proposed structure is validated and investigated both numerically and experimentally.
Keywords :
distribution networks; integrated circuit noise; integrated circuit packaging; multilayers; printed circuits; EBG unit cells; high-speed digital systems; multilayer PCB-package structures; partial EBG placement; power distribution network; reference plane; signal integrity; simultaneous switching noise; uniplanar compact electromagnetic bandgap structure; Circuit noise; Digital systems; Etching; Frequency; Metamaterials; Nonhomogeneous media; Packaging; Periodic structures; Power systems; Telecommunication switching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
Type :
conf
DOI :
10.1109/EDAPS.2008.4736006
Filename :
4736006
Link To Document :
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