Title :
Optimization of via structure in multilayer PCB for high speed signal transmission
Author :
Kang, Bong-Gyu ; Kim, Hyun ; Hee-Do Kang ; Yook, Jong-Gwan
Author_Institution :
Dept. of Electr. & Electron. Eng., Yonsei Univ., South Korea
Abstract :
44-layers PCB (printed circuit board) for semiconductor test has been analyzed and optimized to improve the transmission performance. By dividing the PCB to subsections and analyzing each section, stub resonance reported in [1] brings the degeneration of transmission performance.
Keywords :
printed circuit testing; printed circuits; 3D full EM simulation; blind via; circuit simulation; clearance pad; high speed signal transmission; multilayer PCB; printed circuit board; resonance frequency; via structure; Circuit simulation; Circuit testing; Costs; Frequency; Nonhomogeneous media; Performance analysis; Resonance; Semiconductor device testing; Signal analysis; System testing;
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
DOI :
10.1109/EDAPS.2008.4736010
