Title :
A novel method for suppression of vertical coupling in multi-layered substrates
Author :
Sankaran, Nithya ; Swaminathan, Madhavan ; Tummala, Rao
Author_Institution :
Packaging Res. Centre (PRC), Georgia Inst. of Technol. Atlanta, Atlanta, GA, USA
Abstract :
This paper demonstrates the suppression of vertical coupling between multiple plane pairs in GHz range of frequencies with electromagnetic band-gap structures (EBGs). For the first time, dispersion diagrams have been developed for the EBGs used in vertical isolation giving insight into the coupling suppression. Results from simulations, measurements and analytical methods are presented to demonstrate the proposed method.
Keywords :
integrated optics; integrated optoelectronics; isolation technology; packaging; photonic band gap; dispersion diagrams; electromagnetic band-gap structures; multilayer packaging; multilayered substrates; multiple plane pairs; vertical coupling suppression; vertical isolation; Apertures; Counting circuits; Electromagnetic coupling; Frequency; Isolation technology; Metamaterials; Nonhomogeneous media; Packaging; Partial response channels; Periodic structures;
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
DOI :
10.1109/EDAPS.2008.4736015
