DocumentCode
2176762
Title
A novel method for suppression of vertical coupling in multi-layered substrates
Author
Sankaran, Nithya ; Swaminathan, Madhavan ; Tummala, Rao
Author_Institution
Packaging Res. Centre (PRC), Georgia Inst. of Technol. Atlanta, Atlanta, GA, USA
fYear
2008
fDate
10-12 Dec. 2008
Firstpage
124
Lastpage
127
Abstract
This paper demonstrates the suppression of vertical coupling between multiple plane pairs in GHz range of frequencies with electromagnetic band-gap structures (EBGs). For the first time, dispersion diagrams have been developed for the EBGs used in vertical isolation giving insight into the coupling suppression. Results from simulations, measurements and analytical methods are presented to demonstrate the proposed method.
Keywords
integrated optics; integrated optoelectronics; isolation technology; packaging; photonic band gap; dispersion diagrams; electromagnetic band-gap structures; multilayer packaging; multilayered substrates; multiple plane pairs; vertical coupling suppression; vertical isolation; Apertures; Counting circuits; Electromagnetic coupling; Frequency; Isolation technology; Metamaterials; Nonhomogeneous media; Packaging; Partial response channels; Periodic structures;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location
Seoul
Print_ISBN
978-1-4244-2633-1
Electronic_ISBN
978-1-4244-2634-8
Type
conf
DOI
10.1109/EDAPS.2008.4736015
Filename
4736015
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