• DocumentCode
    2176790
  • Title

    Modeling of microcontroller with multiple power supply pins for conducted EMI simulations

  • Author

    Iokibe, Kengo ; Higashi, Ryota ; Tsuda, Takahiro ; Ichikawa, Kouji ; Nakamura, Katsumi ; Toyota, Yoshitaka ; Koga, Ryuji

  • Author_Institution
    Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama, Japan
  • fYear
    2008
  • fDate
    10-12 Dec. 2008
  • Firstpage
    135
  • Lastpage
    138
  • Abstract
    An EMC macro-model of a 16-bit microcontroller with multiple-power-supply pins has been proposed for estimating the conducted EMI from a power-supply network. The macro-model, called the linear equivalent circuit and current sources (LECCS) model, is composed of multiple circuit blocks and multiple current sources corresponding to the composition of the chip circuits in the microcontroller, i.e., a current source for a circuit block. A current source statistically expresses the total RF current occurring in the corresponding circuit block. We confirmed that the proposed model could correctly estimate the RF power-supply currents under different decoupling conditions up to 300 MHz. We also found that a linear circuit of the regulator between the I/O and core circuit blocks could express the RF coupling between the two blocks.
  • Keywords
    constant current sources; electromagnetic compatibility; electromagnetic interference; equivalent circuits; microcontrollers; 16-bit microcontroller modeling; EMC macro-model; I/O circuit blocks; LECCS model; RF power-supply current estimation; chip circuit composition; conducted EMI simulations; core circuit blocks; decoupling condition; linear equivalent circuit-and-current source; multiple circuit blocks; multiple current sources; multiple power supply pins; power-supply network; Circuit simulation; Electromagnetic compatibility; Electromagnetic interference; Equivalent circuits; Linear circuits; Microcontrollers; Pins; Power supplies; Radio frequency; Regulators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-2633-1
  • Electronic_ISBN
    978-1-4244-2634-8
  • Type

    conf

  • DOI
    10.1109/EDAPS.2008.4736018
  • Filename
    4736018