DocumentCode
2176790
Title
Modeling of microcontroller with multiple power supply pins for conducted EMI simulations
Author
Iokibe, Kengo ; Higashi, Ryota ; Tsuda, Takahiro ; Ichikawa, Kouji ; Nakamura, Katsumi ; Toyota, Yoshitaka ; Koga, Ryuji
Author_Institution
Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama, Japan
fYear
2008
fDate
10-12 Dec. 2008
Firstpage
135
Lastpage
138
Abstract
An EMC macro-model of a 16-bit microcontroller with multiple-power-supply pins has been proposed for estimating the conducted EMI from a power-supply network. The macro-model, called the linear equivalent circuit and current sources (LECCS) model, is composed of multiple circuit blocks and multiple current sources corresponding to the composition of the chip circuits in the microcontroller, i.e., a current source for a circuit block. A current source statistically expresses the total RF current occurring in the corresponding circuit block. We confirmed that the proposed model could correctly estimate the RF power-supply currents under different decoupling conditions up to 300 MHz. We also found that a linear circuit of the regulator between the I/O and core circuit blocks could express the RF coupling between the two blocks.
Keywords
constant current sources; electromagnetic compatibility; electromagnetic interference; equivalent circuits; microcontrollers; 16-bit microcontroller modeling; EMC macro-model; I/O circuit blocks; LECCS model; RF power-supply current estimation; chip circuit composition; conducted EMI simulations; core circuit blocks; decoupling condition; linear equivalent circuit-and-current source; multiple circuit blocks; multiple current sources; multiple power supply pins; power-supply network; Circuit simulation; Electromagnetic compatibility; Electromagnetic interference; Equivalent circuits; Linear circuits; Microcontrollers; Pins; Power supplies; Radio frequency; Regulators;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location
Seoul
Print_ISBN
978-1-4244-2633-1
Electronic_ISBN
978-1-4244-2634-8
Type
conf
DOI
10.1109/EDAPS.2008.4736018
Filename
4736018
Link To Document