Title :
A concise multiple scattering method for via array analysis in a circular plate pair
Author :
Zhang, Yaojiang ; Fan, Jun ; Chada, Arun Reddy ; Drewniak, James L.
Author_Institution :
EMC Lab., Missouri Univ. of Sci. & Technol., MO, USA
Abstract :
Parallel plate modes are excited by the magnetic frill currents in the via holes (anti-pads). These modes are expressed as cylindrical waves. Multiple scattering of these modes among vias as well as from the edge boundaries of the plate pair are rigorously considered with the addition theorem of the cylindrical waves. An admittance matrix is derived for the via ports at the top/bottom surfaces of the via holes. Good agreement has been found between numerical simulations and the algorithm presented.
Keywords :
circular waveguides; electromagnetic wave scattering; electronics packaging; matrix algebra; parallel plate waveguides; printed circuit design; PCB packages; admittance matrix; circular plate pair; concise multiple scattering method; cylindrical waves; edge boundaries; magnetic frill currents; multilayer printed circuit boards; multiple mode scattering; numerical simulations; parallel plate modes; via array analysis; via circuit model; via-plate capacitances; Admittance; Boundary conditions; Circuits; Electromagnetic compatibility; Electromagnetic interference; Electromagnetic scattering; Green´s function methods; Laboratories; Magnetic analysis; Packaging;
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
DOI :
10.1109/EDAPS.2008.4736020
