Title :
A feasibility study of antenna in a package technology for 40GHz front-end module
Author :
Byun, Woo-Jin ; Kim, Bong-Su ; Kim, Kwang-Seon ; Kim, Jong-Myun ; Song, Myung-Sun
Author_Institution :
Radio Technol. Dept., ETRI, South Korea
Abstract :
In this paper, a front-end module integrated with a planar dipole antenna based on LTCC technology is proposed and its feasibility is studied at 40 GHz band. Front-end module is a part of 40 GHz transceiver and consists of a single pole double throw (SPDT) switch, a laminated waveguide filter and a planar dipole antenna. The proposed structure shows good agreements between measured and simulated results. Size of the proposed structure is 27.5 × 5.85 mm2.
Keywords :
band-pass filters; ceramic packaging; dipole antennas; laminates; millimetre wave antennas; millimetre wave filters; millimetre wave integrated circuits; modules; planar antennas; switches; transceivers; waveguide filters; LTCC technology; bandwidth 40 GHz; front-end module; laminated waveguide bandpass filter; package technology; planar dipole antenna; single pole double throw switch; transceiver; Band pass filters; Dipole antennas; Integrated circuit technology; Microstrip antennas; Millimeter wave technology; Packaging; Resonator filters; Switches; Transceivers; Waveguide components;
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
DOI :
10.1109/EDAPS.2008.4736034
