DocumentCode
2177215
Title
Coupled high-speed interconnect analysis on parallel platforms
Author
Paul, D. ; Nakhla, N.M. ; Achar, R. ; Nakhla, M.S.
Author_Institution
Dept. of Electron., Carleton Univ., Ottawa, ON, Canada
fYear
2008
fDate
10-12 Dec. 2008
Firstpage
202
Lastpage
205
Abstract
Signal integrity analysis is becoming extremely important in validation of high-speed designs. In a system containing high-speed interconnects, the presence of a large number of coupled lines presents difficult challenges for performing fast simulations. In this paper, a novel parallel algorithm based on both physical and time-domain partitioning is proposed that allows for the efficient analysis of circuits containing large number of coupled lines. The proposed method exploits the recently developed method of combining transverse partitioning and waveform relaxation. Examples are provided to demonstrate the efficiency and scalability of the proposed algorithm.
Keywords
electronic engineering computing; integrated circuit design; integrated circuit interconnections; parallel algorithms; time-domain analysis; circuit analysis; coupled high-speed interconnect analysis; high-speed design; integrated circuit technology; parallel algorithm; parallel platform; physical partitioning; signal integrity analysis; time-domain partitioning; transverse partitioning; waveform relaxation; Algorithm design and analysis; Circuit analysis; Circuit simulation; Coupling circuits; Integrated circuit interconnections; Parallel algorithms; Scalability; Signal analysis; Signal design; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location
Seoul
Print_ISBN
978-1-4244-2633-1
Electronic_ISBN
978-1-4244-2634-8
Type
conf
DOI
10.1109/EDAPS.2008.4736035
Filename
4736035
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