• DocumentCode
    2177215
  • Title

    Coupled high-speed interconnect analysis on parallel platforms

  • Author

    Paul, D. ; Nakhla, N.M. ; Achar, R. ; Nakhla, M.S.

  • Author_Institution
    Dept. of Electron., Carleton Univ., Ottawa, ON, Canada
  • fYear
    2008
  • fDate
    10-12 Dec. 2008
  • Firstpage
    202
  • Lastpage
    205
  • Abstract
    Signal integrity analysis is becoming extremely important in validation of high-speed designs. In a system containing high-speed interconnects, the presence of a large number of coupled lines presents difficult challenges for performing fast simulations. In this paper, a novel parallel algorithm based on both physical and time-domain partitioning is proposed that allows for the efficient analysis of circuits containing large number of coupled lines. The proposed method exploits the recently developed method of combining transverse partitioning and waveform relaxation. Examples are provided to demonstrate the efficiency and scalability of the proposed algorithm.
  • Keywords
    electronic engineering computing; integrated circuit design; integrated circuit interconnections; parallel algorithms; time-domain analysis; circuit analysis; coupled high-speed interconnect analysis; high-speed design; integrated circuit technology; parallel algorithm; parallel platform; physical partitioning; signal integrity analysis; time-domain partitioning; transverse partitioning; waveform relaxation; Algorithm design and analysis; Circuit analysis; Circuit simulation; Coupling circuits; Integrated circuit interconnections; Parallel algorithms; Scalability; Signal analysis; Signal design; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-2633-1
  • Electronic_ISBN
    978-1-4244-2634-8
  • Type

    conf

  • DOI
    10.1109/EDAPS.2008.4736035
  • Filename
    4736035