DocumentCode
2179005
Title
Millimeter-wave three-dimensional masterslice MMICS
Author
Nishikawa, K. ; Kamogawa, K. ; Inoue, K. ; Onodera, K. ; Hirano, M. ; Tokumitsu, T. ; Toyoda, I.
Author_Institution
NTT Wireless Syst. Labs., Kanagawa, Japan
fYear
1998
fDate
11-8 June 1998
Firstpage
239
Lastpage
242
Abstract
The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm/sup 2/. A U-band single-chip downconverter is also demonstrated.
Keywords
MIMIC; application specific integrated circuits; integrated circuit design; millimetre wave amplifiers; millimetre wave frequency convertors; 5.3 dB; 8 dB; U-band; V-band; design procedures; fabrication cost; integration levels; millimetre-wave amplifiers; single-chip downconverter; three-dimensional masterslice MMICS; turn-around-time; Coupling circuits; Dielectric substrates; Gallium arsenide; MMICs; Microstrip; Millimeter wave circuits; Millimeter wave communication; Millimeter wave radar; Millimeter wave technology; Millimeter wave transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE
Conference_Location
Baltimore, MD, USA
ISSN
1097-2633
Print_ISBN
0-7803-4439-1
Type
conf
DOI
10.1109/RFIC.1998.682089
Filename
682089
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