Title :
Efficient Full-Wave Analysis of Multilayer Interconnection Structures Using a Novel Domain Decomposition-Model Order Reduction Method
Author :
Lee, Shih-Hao ; Jin, Jian-Ming
Author_Institution :
Univ. of Illinois at Urbana-Champaign, Urbana
Abstract :
An efficient domain decomposition-model order reduction method is proposed for a fast broadband finite-element analysis of multilayer interconnection structures. Significant enhancement in the computational efficiency is achieved while still maintaining the strong capability of geometry and material modeling as well as the full-wave accuracy.
Keywords :
decomposition; finite element analysis; integrated circuit interconnections; domain decomposition-model order reduction method; fast broadband finite-element analysis; full-wave analysis; multilayer interconnection structure; Ambient intelligence; Apertures; Boundary conditions; Computational efficiency; Electromagnetic analysis; Finite element methods; Frequency; Nonhomogeneous media; Reduced order systems; Solid modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
DOI :
10.1109/EPEP.2007.4387126
