Title :
SW-HW-EM modeling flow for multi-port EMI optimization of component placement in mobile devices
Author :
Tarvainen, Tanja ; Ruokamo, Tuukka ; Hynynen, Lauri ; Kelander, Llkka ; Kotiranta, Pia
Author_Institution :
Esju Oy, Oulu
Abstract :
Control of noise coupling between high-speed interconnections and RF components in mobile devices is vital. This paper discusses software-hardware-electromagnetics modeling flow for early on EMI optimization of component, such as high speed interconnection, placement.
Keywords :
electromagnetic coupling; interconnections; optimisation; radiofrequency interference; RF component; SW-HW-EM modeling flow; component placement; high-speed interconnection; mobile device; multiport EMI optimization; noise coupling control; software-hardware-electromagnetics modeling; Clocks; Design methodology; Electromagnetic coupling; Electromagnetic interference; Electromagnetic modeling; Frequency; Hardware; Mathematical model; Packaging; Scattering parameters;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
DOI :
10.1109/EPEP.2007.4387129
