DocumentCode
2180607
Title
Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory
Author
Payandehjoo, Kasra ; Kostka, Darryl ; Abhari, Ramesh
Author_Institution
McGill Univ., Montreal
fYear
2007
fDate
29-31 Oct. 2007
Firstpage
271
Lastpage
274
Abstract
Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM´s EIP tool. EIP is also employed to predict the current distribution on the grid and to simplify the MTL model.
Keywords
electronics packaging; integrated circuit design; integrated circuit interconnections; multiconductor transmission lines; network synthesis; IBM EIP tool; electrical interconnect and packaging; mesh network; multiconductor transmission line theory; multilayer power distribution network; Circuits; Conductors; Crosstalk; Electromagnetic interference; Impedance; Multiconductor transmission lines; Nonhomogeneous media; Power systems; Predictive models; Solids;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-0883-2
Type
conf
DOI
10.1109/EPEP.2007.4387179
Filename
4387179
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