• DocumentCode
    2180693
  • Title

    A Recovery Algorithm of Linear Complexity in the Time-Domain Layered Finite Element Reduction Recovery (LAFE-RR) Method for Large Scale Electromagnetic Analysis of High-Speed ICs

  • Author

    Gan, Houle ; Jiao, Dan

  • Author_Institution
    Purdue Univ, Lafayette
  • fYear
    2007
  • fDate
    29-31 Oct. 2007
  • Firstpage
    287
  • Lastpage
    290
  • Abstract
    Time-domain layered finite element reduction recovery (LAFE-RR) method was recently developed for large scale electromagnetic analysis of high-speed ICs. This method is capable of analytically and rigorously reducing the system matrix of a 3D multilayer circuit to that of a single layer one irrespective of the original problem size. In addition, it preserves the sparsity of the original system matrix. In this paper, we propose an efficient algorithm to recover the volume unknowns in the time-domain LAFE-RR method. This algorithm constitutes a direct solution of the matrix formed by volume unknowns in each layer. This direct solution possesses a linear complexity in both CPU run time and memory consumption. The cost of matrix factorization is negligible. The cost of matrix solution is linear. Numerical and experimental results have demonstrated the accuracy and efficiency of the proposed algorithm.
  • Keywords
    circuit analysis computing; computational complexity; electromagnetic fields; finite element analysis; integrated circuit modelling; matrix decomposition; time-domain analysis; 3D multilayer circuit; high-speed integrated circuit; large scale electromagnetic analysis; linear complexity; matrix factorization; recovery algorithm; time-domain layered finite element reduction recovery; Central Processing Unit; Circuit simulation; Costs; Electromagnetic analysis; Finite element methods; Large-scale systems; Nonhomogeneous media; Sparse matrices; Time domain analysis; Very large scale integration; On-chip; electromagnetic simulation; large-scale; time domain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2007 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-0883-2
  • Type

    conf

  • DOI
    10.1109/EPEP.2007.4387183
  • Filename
    4387183