• DocumentCode
    2180967
  • Title

    Fast EMC Analysis of High-Speed Interconnects via Waveform Relaxation and Transverse Partitioning

  • Author

    Sridhar, Arvind ; Nakhla, Natalie ; Achar, Ram ; Nakhla, Michel

  • Author_Institution
    Carleton Univ., Ottawa
  • fYear
    2007
  • fDate
    29-31 Oct. 2007
  • Firstpage
    329
  • Lastpage
    332
  • Abstract
    This paper presents an efficient method for simulating a large number of coupled interconnects in the presence of electromagnetic interference. The algorithm is based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm increases only linearly with the number of lines compared to the more than cubic growth in conventional methods. In addition, the algorithm gives leads to parallel implementation providing further savings in computational cost.
  • Keywords
    electromagnetic compatibility; electromagnetic interference; integrated circuit interconnections; iterative methods; EMC analysis; coupled interconnects simulation; electromagnetic interference; high-speed interconnects; transverse partitioning; waveform relaxation; Analytical models; Circuit simulation; Computational efficiency; Computational modeling; Coupling circuits; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic interference; Integrated circuit interconnections; Partitioning algorithms;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2007 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-0883-2
  • Type

    conf

  • DOI
    10.1109/EPEP.2007.4387194
  • Filename
    4387194