DocumentCode
2180967
Title
Fast EMC Analysis of High-Speed Interconnects via Waveform Relaxation and Transverse Partitioning
Author
Sridhar, Arvind ; Nakhla, Natalie ; Achar, Ram ; Nakhla, Michel
Author_Institution
Carleton Univ., Ottawa
fYear
2007
fDate
29-31 Oct. 2007
Firstpage
329
Lastpage
332
Abstract
This paper presents an efficient method for simulating a large number of coupled interconnects in the presence of electromagnetic interference. The algorithm is based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm increases only linearly with the number of lines compared to the more than cubic growth in conventional methods. In addition, the algorithm gives leads to parallel implementation providing further savings in computational cost.
Keywords
electromagnetic compatibility; electromagnetic interference; integrated circuit interconnections; iterative methods; EMC analysis; coupled interconnects simulation; electromagnetic interference; high-speed interconnects; transverse partitioning; waveform relaxation; Analytical models; Circuit simulation; Computational efficiency; Computational modeling; Coupling circuits; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic interference; Integrated circuit interconnections; Partitioning algorithms;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-0883-2
Type
conf
DOI
10.1109/EPEP.2007.4387194
Filename
4387194
Link To Document