Electromagnetic Simulation for Inhomogeneous Interconnect and Packaging Structures

The paper contains a novel mechanism for full wave electromagnetic simulation of complicated inhomogeneous structures, such as on-chip interconnects, IC packaging, antennas, and scattering objects. It uses only equivalent principle based EFIE instead of both EFIE and MFIE to establish the surface integral equations for practical inhomogeneous structure so that a much more simplified formulation process is needed in the EM simulation procedure. To overcome the numerical error of K operator in the formulation, a new analytical solution to the K operator for general full-wave integral equations is provided. Numerical results are demonstrated to verify the proposed algorithm.