DocumentCode
2181172
Title
Cylindrical Conduction Mode Basis Functions for Modeling of Inductive Couplings in System-in-Package (SiP)
Author
Han, Ki Jin ; Engin, Ege ; Swaminathan, Madhavan
Author_Institution
Georgia Inst. of Technol., Atlanta
fYear
2007
fDate
29-31 Oct. 2007
Firstpage
361
Lastpage
364
Abstract
PEEC method with global basis functions on the cylindrical coordinates is presented for efficient modeling of bond wires in system-in-package. Combination of a few basis functions accurately describes high-frequency effects of closely located wires with shorter simulation time compared to the conventional PEEC method. Simplified equivalent circuit from the proposed method is also favorable for modeling of large coupling structures.
Keywords
equivalent circuits; lead bonding; system-in-package; PEEC method; SiP; bond wires; closely located wires; cylindrical conduction mode basis functions; equivalent circuit; high-frequency effects; inductive couplings; system-in-package; Bonding; Circuit simulation; Conductors; Coupling circuits; Equivalent circuits; Frequency; Integrated circuit packaging; Proximity effect; Solid modeling; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-0883-2
Type
conf
DOI
10.1109/EPEP.2007.4387203
Filename
4387203
Link To Document