Title :
Cylindrical Conduction Mode Basis Functions for Modeling of Inductive Couplings in System-in-Package (SiP)
Author :
Han, Ki Jin ; Engin, Ege ; Swaminathan, Madhavan
Author_Institution :
Georgia Inst. of Technol., Atlanta
Abstract :
PEEC method with global basis functions on the cylindrical coordinates is presented for efficient modeling of bond wires in system-in-package. Combination of a few basis functions accurately describes high-frequency effects of closely located wires with shorter simulation time compared to the conventional PEEC method. Simplified equivalent circuit from the proposed method is also favorable for modeling of large coupling structures.
Keywords :
equivalent circuits; lead bonding; system-in-package; PEEC method; SiP; bond wires; closely located wires; cylindrical conduction mode basis functions; equivalent circuit; high-frequency effects; inductive couplings; system-in-package; Bonding; Circuit simulation; Conductors; Coupling circuits; Equivalent circuits; Frequency; Integrated circuit packaging; Proximity effect; Solid modeling; Wires;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
DOI :
10.1109/EPEP.2007.4387203
