• DocumentCode
    2181173
  • Title

    Automatic three-phase squirrel-cage induction motor test assembly for motor thermal behaviour studies

  • Author

    Filho, E. Rubber ; Riehl, Rudolf Ribeiro ; Avólio, E.

  • Author_Institution
    DSCP, Univ. Estadual de Campinas, Brazil
  • fYear
    1994
  • fDate
    25-27 May 1994
  • Firstpage
    204
  • Lastpage
    209
  • Abstract
    This paper presents a laboratory assembly to perform, automatically, three-phase squirrel cage induction motor load tests. Besides the motor, mechanical load (fan), drive and electrical protection equipment, the assembly comprises a 12 bits data acquisition system, a software controlled electronic driving system, temperature sensors and a microcomputer. It is useful for fast and reliable motor part temperatures acquisition during any load test proposed via a computer keyboard allowing for the data storage for motor thermal behavior studies. The performance of the assembly was checked by performing load tests according to the duty types proposed in IEC Publ. 34-1, Rotating electrical machines, Part 1: Rating and Performance, 8th edition, 1983
  • Keywords
    automatic test equipment; data acquisition; machine testing; power engineering computing; squirrel cage motors; temperature measurement; test facilities; thermal analysis; 12 bits data acquisition system; automatic testing; data storage; drive equipment; electrical protection equipment; fan; induction motor test assembly; mechanical load; microcomputer; motor part temperatures acquisition; motor thermal behaviour studies; software controlled electronic driving system; temperature sensors; three-phase squirrel-cage induction motor; Assembly systems; Automatic testing; Data acquisition; Induction motors; Laboratories; Micromotors; Performance evaluation; Protection; Software systems; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 1994. Symposium Proceedings, ISIE '94., 1994 IEEE International Symposium on
  • Conference_Location
    Santiago
  • Print_ISBN
    0-7803-1961-3
  • Type

    conf

  • DOI
    10.1109/ISIE.1994.333157
  • Filename
    333157