Experimental study on EFO process of thermosonic wire bonding by using high-speed video record

Author

Kang, Xiang ; Lei, Han ; Fu-liang, Wang ; Jun-hui, Li

Author_Institution

Coll. of Mech. & Electron. Eng., Central South Univ., Changsha, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

The stable bonding of gold wire is becoming more and more important with the development of high integration and miniaturization of semiconductor. At the beginning of the thermosonic wire bonding cycle, the auto wire bonder uses an Electronic Flame-Off (EFO) unit to create a Free Air Ball(FAB). As FAB affects the quality of the first bond directly, consistency of FAB formation is very important for the stable wire bonding. In this study, a high-speed camera system was used to record the EFO and FAB formation process under different EFO currents. Continuous image sequences of FAB formation were processed by using matlab software. Finally, the influence law of EFO current on FAB fomation was obtained.

Keywords

image sequences; lead bonding; semiconductor device packaging; video cameras; video recording; EFO process; FAB formation process; Matlab software; auto wire bonder; continuous image sequences; electronic flame-off unit; free air ball; gold wire bonding; high-speed camera system; high-speed video recording; semiconductor packaging technology; thermosonic wire bonding; Bonding; Cameras; Gold; Heating; Packaging; Shape; Wires; EFO; FAB; highspeed camera; matlab; thermosonic wire bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066786

Filename

6066786