Title :
Integrated antennas for RF sensing, wireless communications and energy harvesting applications
Author :
Russer, Peter ; Russer, Johannes A. ; Mukhtar, Farooq ; Lugli, Paolo ; Wane, S. ; Bajon, D. ; Porod, Wolfgang
Author_Institution :
Inst. for Nanoelectron., Tech. Univ. Munchen, Garching, Germany
Abstract :
Silicon-based monolithic integrated millimeterwave circuits today facilitate the realization of millimeterwave communication and sensing systems [1], [2]. Monolithic integration of antennas into transmitter and receiver front ends reduces weight and costs of millimeterwave systems [3]. As the structure size of circuit devices and components is continuously decreasing the same will hold true for antennas and radiation elements used in integrated circuits for on-chip and chip-to-chip communication. An interesting option to overcome the bandwidth limitations for signal transmission on or between monolithic integrated circuits is wireless chip-to-chip and on-chip interconnects via integrated antennas. Instead of dedicating chip area for the antenna, the antenna can make use of the available on-chip metallization. Antenna-coupled thermal sensors offer a unique choice for infrared detection applications. A considerable size reduction of integrated antenna structures may be achieved using carbon nanotubes and graphene as the antenna material. Plasmonic nanostructures allow realizing ultra small antenna structures for detection applications.
Keywords :
MMIC; antenna radiation patterns; carbon nanotubes; elemental semiconductors; energy harvesting; infrared detectors; integrated circuit interconnections; silicon; RF sensing; antenna material; antenna monolithic integration; antenna-coupled thermal sensors; bandwidth limitations; carbon nanotubes; chip-to-chip communication; circuit device structure size; component structure size; graphene; infrared detection applications; integrated antenna structure size reduction; integrated antennas; millimeterwave communication; millimeterwave system cost reduction; millimeterwave system weight reduction; on-chip communication; on-chip metallization; plasmonic nanostructures; radiation elements; receiver front end; signal transmission; silicon-based monolithic integrated millimeterwave circuits; transmitter front end; wireless chip-to-chip interconnects; wireless communications; wireless on-chip interconnects; Antenna measurements; Dipole antennas; Graphene; Integrated circuit modeling; Wireless communication;
Conference_Titel :
Antenna Technology (iWAT), 2013 International Workshop on
Conference_Location :
Karlsruhe
Print_ISBN :
978-1-4673-2830-2
Electronic_ISBN :
978-1-4673-2829-6
DOI :
10.1109/IWAT.2013.6518285