Title :
Electrical characterization of cylindrical and annular TSV for combined application thereof
Author :
Sun, Xin ; Cui, Qinghu ; Zhu, Yunhui ; Zhu, Zhiyuan ; Miao, Min ; Chen, Jing ; Jin, Yufeng
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Abstract :
In this paper, the potential application of combining cylindrical TSV and annular TSV into 3D integration was studied. First, the schematic fabrication process of cylindrical and annular TSV was proposed. Lumped equivalent circuit model of these different kinds of TSV structures from the physical configuration were studied and verified. Besides, 3D full wave electromagnetic (EM) simulations of cylindrical TSVs and annular TSVs were performed to verify the proposed lumped model of TSV.
Keywords :
electronics packaging; equivalent circuits; three-dimensional integrated circuits; 3D full wave electromagnetic simulations; 3D integration; annular TSV; cylindrical TSV; electrical characterization; lumped equivalent circuit model; Inductance; Integrated circuit modeling; Resistance; Silicon; Solid modeling; Three dimensional displays; Through-silicon vias;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066794
