Electrical characterization of cylindrical and annular TSV for combined application thereof

Author

Sun, Xin ; Cui, Qinghu ; Zhu, Yunhui ; Zhu, Zhiyuan ; Miao, Min ; Chen, Jing ; Jin, Yufeng

Author_Institution

Inst. of Microelectron., Peking Univ., Beijing, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

5

Abstract

In this paper, the potential application of combining cylindrical TSV and annular TSV into 3D integration was studied. First, the schematic fabrication process of cylindrical and annular TSV was proposed. Lumped equivalent circuit model of these different kinds of TSV structures from the physical configuration were studied and verified. Besides, 3D full wave electromagnetic (EM) simulations of cylindrical TSVs and annular TSVs were performed to verify the proposed lumped model of TSV.

Keywords

electronics packaging; equivalent circuits; three-dimensional integrated circuits; 3D full wave electromagnetic simulations; 3D integration; annular TSV; cylindrical TSV; electrical characterization; lumped equivalent circuit model; Inductance; Integrated circuit modeling; Resistance; Silicon; Solid modeling; Three dimensional displays; Through-silicon vias;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066794

Filename

6066794