Investigation on microstructures and properties of low Ag content lead-free solder alloy

Author

Wei, Guoqiang ; Wan, Zhonghua ; Xue, Mingyang ; Wang, Lei

Author_Institution

Sch. of Mech. & Automotive Eng., South China Univ. of Technol., Guangzhou, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

The microstructure, the wettability and dissolution behavior of Sn0.8Ag0.5Cu2.0Bi0.05Ni (SACBN) and Sn3.0Ag0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. The results show that the microstructure of SACBN solder alloy contains β-Sn and eutectic phase, and that the eutectic phase is made of β-Sn, well-ditributed needlelike Ag3Sn, granular (Cu, Ni)6Sn5 and minor granular Bi. The max wetting force of SACBN was higher, and the wetting time was shorter than SAC305 while the wetting angle is bigger and the spreading area is smaller under same temperature. The dissolution quantity of Cu substrate linearly increases with increasing immersion time in the two solder alloys. The dissolution rate of SACBN solder alloy is lower than SAC305 at 250°Cand 275°C, and is higher at 300°C.

Keywords

bismuth alloys; copper alloys; dissolving; nickel alloys; silver alloys; solders; tin alloys; wetting; SnAgCu; SnAgCuBiNi; dissolution quantity; eutectic phase; immersion time; lead-free solder alloy; max wetting force; microstructure behavior; minor granular; temperature 250 degC; temperature 275 degC; temperature 300 degC; well-ditributed needlelike; wettability behavior; wetting angle; wetting time; Bismuth; Copper; Lead; Materials; Microstructure; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066796

Filename

6066796