Title :
Wafer level vacuum packaging for MEMS device by solder sealing
Author :
An, Bing ; Tang, Gan-ran ; Sun, Ya-nan ; Lu, Wei-wen ; Wu, Yi-Ping
Author_Institution :
Sch. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
Wafer level vacuum packaging is an emerging method to offer a hermetic cavity for MEMS devices with the smaller size and the lower cost, and is expected to be a new generation packaging technology of mass production to substitute the traditional metallic packaging and ceramic packaging. Solder bonding in a vacuum oven was employed in this work to achieve a Chip-to-Wafer (C2W) vacuum bonding for MEMS device. The results showed that the hermeticity of the samples met the requirements of MIL-STD-883. Effects of the process parameters such as the solder layer thickness, the soaking time of reflow, and the bonding pressure on bonding quality were investigated and optimized.
Keywords :
bonding processes; hermetic seals; micromechanical devices; solders; vacuum techniques; wafer level packaging; MEMS device; MIL-STD-883; bonding pressure; ceramic packaging; chip-to-wafer vacuum bonding; generation packaging technology; hermetic cavity; mass production; metallic packaging; solder bonding; solder layer thickness; solder sealing; vacuum oven; wafer level vacuum packaging; Bonding; Cavity resonators; Micromechanical devices; Military standards; Ovens; Packaging; Vacuum technology;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066803
