Wafer level vacuum packaging for MEMS device by solder sealing

Author

An, Bing ; Tang, Gan-ran ; Sun, Ya-nan ; Lu, Wei-wen ; Wu, Yi-Ping

Author_Institution

Sch. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

Wafer level vacuum packaging is an emerging method to offer a hermetic cavity for MEMS devices with the smaller size and the lower cost, and is expected to be a new generation packaging technology of mass production to substitute the traditional metallic packaging and ceramic packaging. Solder bonding in a vacuum oven was employed in this work to achieve a Chip-to-Wafer (C2W) vacuum bonding for MEMS device. The results showed that the hermeticity of the samples met the requirements of MIL-STD-883. Effects of the process parameters such as the solder layer thickness, the soaking time of reflow, and the bonding pressure on bonding quality were investigated and optimized.

Keywords

bonding processes; hermetic seals; micromechanical devices; solders; vacuum techniques; wafer level packaging; MEMS device; MIL-STD-883; bonding pressure; ceramic packaging; chip-to-wafer vacuum bonding; generation packaging technology; hermetic cavity; mass production; metallic packaging; solder bonding; solder layer thickness; solder sealing; vacuum oven; wafer level vacuum packaging; Bonding; Cavity resonators; Micromechanical devices; Military standards; Ovens; Packaging; Vacuum technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066803

Filename

6066803