DocumentCode :
2182631
Title :
Preparation of micro glass channels for micro-reactors by a chemical foaming process
Author :
Shang, Jintang ; Luo, Xinhu ; Qin, Shunjin ; Chen, Boyin
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
3
Abstract :
A micro glass micro-reactor prepared by a chemical foaming process (CFP) is presented in this paper. By the CFP process, micro glass channels were simultaneously shaped on a glass wafer which consists of the following steps. First, shallow micro channels were etched in a silicon wafer followed by placing foaming agents in the silicon channels. Second, these silicon channels were sealed with a thin glass wafer by bonding a glass wafer. Third, the bonded wafers were heated to a temperature above the softening point of the glass and held for several minutes. The gas released by the foaming agents in the silicon cavities blew the softened glass to form a glass channel followed by cooling and annealing. Then, the hot-formed glass channels decorated by nano-sized catalysis, TiO2, were used as photocatalytic microfluidic reactors to exploit the application of the CFP-made micro glass channels. Methylene blue was filled into the micro glass channels followed by UV exposure to test the photocatalytic properties. Results showed that micro channels were prepared successfully. Results also indicate that the photocatalytic properties of nano-sized TiO2 were improved by using micro glass channels for their high specific area.
Keywords :
annealing; cooling; microfabrication; microfluidics; microreactors; tin compounds; wafer bonding; Si; TiO2; annealing; chemical foaming process; cooling; glass wafer; glass wafer bonding; hot-formed glass channels; methylene blue; microglass channel fabrications; microglass channel preparation; microglass microreactor; nanosized catalysis; photocatalytic microfluidic reactors; silicon wafer; thin glass wafer; Absorption; Cavity resonators; Chemicals; Glass; Inductors; Silicon; Titanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066805
Filename :
6066805
Link To Document :
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