Title :
Retarding electromigration on the Sn-Ag-Cu solder joints by micro-sized metal-particle reinforcement
Author :
Ma, Limin ; Xu, Guangchen ; Guo, Fu ; Wang, Xitao
Author_Institution :
Coll. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China
Abstract :
Electromigration (EM) has become one of the reliability concerns to the fine pitch solder joint due to its increasing capacity to bear the high current density The EM effects on microstructure evolution of Sn-3.0Ag-0.5Cu+XNi (X=0, 0.05, 0.45, 2.0wt. %) solder joint was investigated. Findings of this study indicated that an appropriate addition of Ni element and moderate ambient temperature can alleviate EM damages in solder joint. The intermetallic compound layer which held a planar type and appropriate thickness improved the resistance of EM effects by suppressing the polarity effect. Ag3Sn and the bulk IMCs also retard the effects from current stressing for the solder joint.
Keywords :
copper alloys; current density; electromigration; fine-pitch technology; nickel alloys; silver alloys; solders; tin alloys; EM effects; Ni; Sn-Ag-Cu; current density; electromigration; fine pitch solder joint; intermetallic compound layer; microsized metal-particle reinforcement; polarity effect; Anodes; Cathodes; Copper; Electromigration; Microstructure; Nickel; Soldering;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066819
