Title :
On-chip/in-package integrated antenna for millimeter-wave medium and long-range applications
Author :
Dussopt, Laurent ; Zevallos Luna, Jose A. ; Siligaris, Alexandre
Author_Institution :
CEA-LETI, Grenoble, France
Abstract :
A novel cost-efficient antenna solution for millimeter-wave multi-Gbps wireless communications operating over ranges above 10-20 meters in fixed Line-Of-Sight (LOS) configuration is presented. A first antenna element is integrated on-chip with a CMOS-SOI 60-GHz transceiver circuit in order to benefit from minimum interconnection losses between the front-end circuit and the antenna. This antenna is coupled to an external radiating element embedded in a standard QFN package, enabling an improved radiation gain of 4-6 dBi. Finally, a discrete-lens antenna array fabricated on standard laminate materials is placed above the packaged transceiver in order to focus the radiated beam and reach a gain in excess of 14 dBi.
Keywords :
CMOS integrated circuits; antenna radiation patterns; field effect MIMIC; integrated circuit interconnections; lens antennas; millimetre wave antenna arrays; radio transceivers; silicon-on-insulator; CMOS-SOI transceiver; LOS configuration; Si; discrete-lens antenna array; external radiating element; fixed line-of-sight configuration; frequency 60 GHz; front-end circuit; in-package integrated antenna; interconnection losses; long-range applications; millimeter-wave medium applications; multiGbps wireless communications; on-chip integrated antenna; standard QFN package; Antenna arrays; Arrays; Electronic mail; Lead; System-on-chip;
Conference_Titel :
Antenna Technology (iWAT), 2013 International Workshop on
Conference_Location :
Karlsruhe
Print_ISBN :
978-1-4673-2830-2
Electronic_ISBN :
978-1-4673-2829-6
DOI :
10.1109/IWAT.2013.6518333
