• DocumentCode
    2183531
  • Title

    Integrated millimeter wave filtenna for Q-LINKPAN application

  • Author

    Yu, Shunhua ; Hong, Wei ; Yu, Chen ; Tang, Hongjun ; Chen, Jixin ; Kuai, Zhenqi

  • Author_Institution
    State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China
  • fYear
    2012
  • fDate
    26-30 March 2012
  • Firstpage
    1333
  • Lastpage
    1336
  • Abstract
    An integrated millimeter wave filtenna is proposed using substrate integrated waveguide (SIW) filter as balun and Yagi-Uda antenna as driven elements, the filtenna is fabricated with standard printed circuit board (PCB) process. Compared with Yagi antenna without filter which uses SIW-Microstrip transition as balun, the frequency selectivity is significantly improved by the seamless integrated structure. The filtenna is worked at 41.5-43.5GHz band for Q-LINKPAN application, here Q-LINKPAN is a proposed standard for Chinese millimeter wave high data rate communications. The measured and simulated S-parameters, radiation patterns and the gain of the filtenna are presented to show their performance, and good agreements are achieved between them.
  • Keywords
    Yagi antenna arrays; millimetre wave antennas; printed circuits; substrate integrated waveguides; Chinese millimeter wave high data rate communications; PCB process; Q-LINKPAN application; S-parameters; SIW filter; SIW-microstrip transition; Yagi-Uda antenna; balun; frequency 41.5 GHz to 43.5 GHz; integrated millimeter wave filtenna; printed circuit board process; radiation patterns; seamless integrated structure; substrate integrated waveguide filter; Antennas; Conferences; Europe; Filtenna; Filter; Millimeter wave; Printed Antenna; Q-LINKPAN; Substrate Integrated Waveguide (SIW); Yagi-Uda antenna;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (EUCAP), 2012 6th European Conference on
  • Conference_Location
    Prague
  • Print_ISBN
    978-1-4577-0918-0
  • Electronic_ISBN
    978-1-4577-0919-7
  • Type

    conf

  • DOI
    10.1109/EuCAP.2012.6206170
  • Filename
    6206170