DocumentCode
2183597
Title
Encapsulation and Evaluation of a MEMS-Based Flexible Microelectrode Array for Acute In-Vivo Experiment
Author
Sui, Xiaohong ; Tan, Fei ; Liang, Ting ; Chen, Wei ; Li, Gang ; Ren, Qiushi
Author_Institution
Dept. of Biomed. Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2009
fDate
17-19 Oct. 2009
Firstpage
1
Lastpage
6
Abstract
A novel 16-channel flexible thin-film microelectrode array was fabricated and evaluated for epi-retinal electrical stimulation by MEMS (Micro ElectroMechanical System) processing techniques. It was encapsulated by medical-grade silicone adhesive and suitable for in-vivo application. In-vitro testing results showed that the average impedance of the microelectrode array was uniform at different steps of encapsulation, and the polyimide microelectrode had good biocompatibility with the glial cells. Proper surgery was adopted to implant the microelectrode in the epi-retinal location and the acute in-vivo testing results showed that the amplitude of electrical evoked cortical potential (EECP) could amount to 20 muV with the latency of 12 ms.
Keywords
adhesives; bioMEMS; bioelectric potentials; biomedical electrodes; cellular biophysics; eye; microelectrodes; neurophysiology; prosthetics; surgery; MEMS-based flexible microelectrode array; biocompatibility; electrical evoked cortical potential; encapsulation; epi-retinal electrical stimulation; epi-retinal visual prosthesis; glial cells; medical-grade silicone adhesive; micro electromechanical system; polyimide microelectrode; surgery; time 12 ms; voltage 20 muV; Electrical stimulation; Electromechanical systems; Encapsulation; Impedance; In vitro; Microelectrodes; Micromechanical devices; Polyimides; Testing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Biomedical Engineering and Informatics, 2009. BMEI '09. 2nd International Conference on
Conference_Location
Tianjin
Print_ISBN
978-1-4244-4132-7
Electronic_ISBN
978-1-4244-4134-1
Type
conf
DOI
10.1109/BMEI.2009.5305136
Filename
5305136
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