• DocumentCode
    2183597
  • Title

    Encapsulation and Evaluation of a MEMS-Based Flexible Microelectrode Array for Acute In-Vivo Experiment

  • Author

    Sui, Xiaohong ; Tan, Fei ; Liang, Ting ; Chen, Wei ; Li, Gang ; Ren, Qiushi

  • Author_Institution
    Dept. of Biomed. Eng., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2009
  • fDate
    17-19 Oct. 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A novel 16-channel flexible thin-film microelectrode array was fabricated and evaluated for epi-retinal electrical stimulation by MEMS (Micro ElectroMechanical System) processing techniques. It was encapsulated by medical-grade silicone adhesive and suitable for in-vivo application. In-vitro testing results showed that the average impedance of the microelectrode array was uniform at different steps of encapsulation, and the polyimide microelectrode had good biocompatibility with the glial cells. Proper surgery was adopted to implant the microelectrode in the epi-retinal location and the acute in-vivo testing results showed that the amplitude of electrical evoked cortical potential (EECP) could amount to 20 muV with the latency of 12 ms.
  • Keywords
    adhesives; bioMEMS; bioelectric potentials; biomedical electrodes; cellular biophysics; eye; microelectrodes; neurophysiology; prosthetics; surgery; MEMS-based flexible microelectrode array; biocompatibility; electrical evoked cortical potential; encapsulation; epi-retinal electrical stimulation; epi-retinal visual prosthesis; glial cells; medical-grade silicone adhesive; micro electromechanical system; polyimide microelectrode; surgery; time 12 ms; voltage 20 muV; Electrical stimulation; Electromechanical systems; Encapsulation; Impedance; In vitro; Microelectrodes; Micromechanical devices; Polyimides; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Engineering and Informatics, 2009. BMEI '09. 2nd International Conference on
  • Conference_Location
    Tianjin
  • Print_ISBN
    978-1-4244-4132-7
  • Electronic_ISBN
    978-1-4244-4134-1
  • Type

    conf

  • DOI
    10.1109/BMEI.2009.5305136
  • Filename
    5305136