The study on the shaping of electroplated copper pillar bumping

With the increasing connection density of ICs, the technology of flip chip packaging and stacked-die packaging bounded by bumping are gradually replacing the traditional wire bonding to become one of the main styles of the package. And as one of the critical technology the technology of electroplating copper pillar wins more and more concern. This paper concerns about the influence of the electroplating additives which includes accelerator, leveler and the density of electroplating current to the forming of copper pillar. And by adjusting the quantity of the additives and the density of electroplating current, we got the satisfactory copper pillar with the smooth surface.