DocumentCode
2183691
Title
Microvia PWBs: do they cost more?
Author
Singer, Adam T. ; Bhatdkal, R.M.
Author_Institution
IBIS Assoc., USA
fYear
1998
fDate
9-11 Jun 1998
Firstpage
53
Lastpage
61
Abstract
Microvia technology can allow lower manufacturing cost while offering higher interconnect density. Critical hurdles in actually achieving lower cost depend on design and manufacturing capability. With regard to designs, the degree to which PWB designers take advantage of microvia technology directly translates into cost savings particularly if area reduction can be maximized. Manufacturing capability also impacts the likelihood of cost reduction. Specifically, how panel size is traded off with manufacturing yield has great influence on board cost. This article shows a design case study to show how the tradeoff can be made
Keywords
economics; printed circuit design; printed circuit manufacture; area reduction; board cost; cost savings; interconnect density; manufacturing capability; manufacturing cost; manufacturing yield; microvia PWBs; panel size; Chemical lasers; Conductive films; Copper; Costs; Dielectric films; Dielectric liquids; Etching; Fabrication; Ink; Raw materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro 98. Professional Program Proceedings
Conference_Location
Boston, MA
Print_ISBN
0-7803-4940-7
Type
conf
DOI
10.1109/ELECTR.1998.682106
Filename
682106
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