• DocumentCode
    2183691
  • Title

    Microvia PWBs: do they cost more?

  • Author

    Singer, Adam T. ; Bhatdkal, R.M.

  • Author_Institution
    IBIS Assoc., USA
  • fYear
    1998
  • fDate
    9-11 Jun 1998
  • Firstpage
    53
  • Lastpage
    61
  • Abstract
    Microvia technology can allow lower manufacturing cost while offering higher interconnect density. Critical hurdles in actually achieving lower cost depend on design and manufacturing capability. With regard to designs, the degree to which PWB designers take advantage of microvia technology directly translates into cost savings particularly if area reduction can be maximized. Manufacturing capability also impacts the likelihood of cost reduction. Specifically, how panel size is traded off with manufacturing yield has great influence on board cost. This article shows a design case study to show how the tradeoff can be made
  • Keywords
    economics; printed circuit design; printed circuit manufacture; area reduction; board cost; cost savings; interconnect density; manufacturing capability; manufacturing cost; manufacturing yield; microvia PWBs; panel size; Chemical lasers; Conductive films; Copper; Costs; Dielectric films; Dielectric liquids; Etching; Fabrication; Ink; Raw materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electro 98. Professional Program Proceedings
  • Conference_Location
    Boston, MA
  • Print_ISBN
    0-7803-4940-7
  • Type

    conf

  • DOI
    10.1109/ELECTR.1998.682106
  • Filename
    682106