Effects of soldering temperature and cooling rate on the as-soldered microstructures of intermetallic compounds in Sn-Ag/Cu joint

Author

Gu, Liyu ; Qu, Lin ; Ma, Haitao ; Luo, Zhongbing ; Wang, Lai

Author_Institution

Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

The as-soldered microstructures of intermetallic compounds (IMC) in Sn-Ag/Cu joint were investigated under different soldering temperatures and cooling rates. Scalloped, faceted, prismatic and hexagonal shape Cu6Sn5 grains were observed at the solder/Cu interface, respectively. Scalloped shape grains were found at 250°C. At higher soldering temperatures such as 275 °C and 300°C, faceted grains were dominant and the other two were mainly discovered under smaller cooling rates. Simultaneously, large plate-like Ag3Sn formed in virtue of interfacial Cu6Sn5 under furnace cooling, which was discussed based on the solidification sequence.

Keywords

cooling; copper; crystal microstructure; silver alloys; soldering; solders; tin alloys; SnAg-Cu; as-soldered microstructures; cooling rate; faceted shape grains; hexagonal shape grains; intermetallic compounds; prismatic shape grains; scalloped shape grains; soldering temperature; temperature 250 degC; temperature 275 degC; temperature 300 degC; Compounds; Cooling; Copper; Intermetallic; Joints; Morphology; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066848

Filename

6066848