Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints

Author

Tian, Yanhong ; Niu, Lina ; Wang, Chunqing

Author_Institution

Sch. of Mater. Sci. & Eng., Harbin Inst. of Technol., Harbin, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

Electron backscatter diffraction (EBSD) technology combined with Orientation Imaging Microscopy (OIM) analysis method were employed to investigate the morphologies and orientations of Cu₆Sn₅ grains formed between Sn3.0Ag5.0Cu and polycrystalline copper, (001) (111) Cu single crystals under liquid-state condition. The reflow temperature was the main factor that influence the transformation of Cu₆Sn₅ grains from scallop-type to prism-type. The morphology for. the prism-type Cu₆Sn₅ grains formed on Cu single crystals arranged regularly, and their orientations had a strong dependence on the Cu substrates, the reason for which is the low misfit leading to the decreasing of surface energy.

Keywords

copper alloys; crystal morphology; electron backscattering; electron diffraction; silver alloys; solders; surface energy; tin alloys; (001) (111) Cu single crystals; SnAgCu; electron backscatter diffraction; grain orientations; lead-free solder joints; liquid-state condition; morphology; orientation imaging microscopy; polycrystalline copper; reflow temperature; surface energy; Copper; Crystals; Electronics packaging; Morphology; Packaging; Soldering; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066851

Filename

6066851