Research on SiCp/Cu composites preparation and thixo-forming process simulation

Author

Kaikun, Wang ; Puguang, Song

Author_Institution

Sch. of Mater. Sci. & Eng., Univ. of Sci. & Technol. Beijing, Beijing, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

In this paper, SiCp/Cu composite billet was prepared by powder metallurgy and thixoforming process of electronic packaging shell with SiCp/Cu composite was simulated by the finite element software DEFORM-3D. Microstructure of SiCp/Cu composite billet was studied and the results showed that composite billet prepared by powder metallurgy was dense and the combination between SiC particles and Cu matrix was good, which was suitable for electronic packaging shell thixo-forming. The flow velocity field and the effective stress field in the thixo-forming process were simulated and analyzed. The simulation results showed that, SiCp/Cu composite electronic packaging shell with compact structure could be thixo-formed, which could meet electronic packaging shell requirements.

Keywords

composite materials; electronics packaging; powder metallurgy; thixoforming; SiC-Cu; composite billet; composites preparation; effective stress field; electronics packaging shell; finite element software DEFORM-3D; flow velocity field; powder metallurgy; thixo-forming process simulation; thixoforming process; Billets; Copper; Electronics packaging; Microstructure; Packaging; Powders; Silicon carbide; Electronic packaging shell; Numerical simulation; Powder metallurgy; SiCp/Cu composite; Thixo-forming;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066858

Filename

6066858