• DocumentCode
    2184317
  • Title

    A review of scheduling theory and methods for semiconductor manufacturing cluster tools

  • Author

    Lee, Tae-Eog

  • Author_Institution
    Dept. of Ind. & Syst. Eng., KAIST, Deajeon, South Korea
  • fYear
    2008
  • fDate
    7-10 Dec. 2008
  • Firstpage
    2127
  • Lastpage
    2135
  • Abstract
    Cluster tools, which combine several single-wafer processing modules with wafer handling robots in a closed environment, have been increasingly used for most wafer fabrication processes. We review tool architectures, operational issues, and scheduling requirements. We then explain recent progress in tool science and engineering for scheduling and control of cluster tools.
  • Keywords
    industrial robots; scheduling; wafer level packaging; scheduling theory; semiconductor manufacturing cluster tools; single-wafer processing modules; wafer fabrication processes; wafer handling robots; Chemical technology; Circuits; Delay effects; Fabrication; Job shop scheduling; Manufacturing industries; Orbital robotics; Robots; Semiconductor device manufacture; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference, 2008. WSC 2008. Winter
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-2707-9
  • Electronic_ISBN
    978-1-4244-2708-6
  • Type

    conf

  • DOI
    10.1109/WSC.2008.4736310
  • Filename
    4736310