DocumentCode
2184317
Title
A review of scheduling theory and methods for semiconductor manufacturing cluster tools
Author
Lee, Tae-Eog
Author_Institution
Dept. of Ind. & Syst. Eng., KAIST, Deajeon, South Korea
fYear
2008
fDate
7-10 Dec. 2008
Firstpage
2127
Lastpage
2135
Abstract
Cluster tools, which combine several single-wafer processing modules with wafer handling robots in a closed environment, have been increasingly used for most wafer fabrication processes. We review tool architectures, operational issues, and scheduling requirements. We then explain recent progress in tool science and engineering for scheduling and control of cluster tools.
Keywords
industrial robots; scheduling; wafer level packaging; scheduling theory; semiconductor manufacturing cluster tools; single-wafer processing modules; wafer fabrication processes; wafer handling robots; Chemical technology; Circuits; Delay effects; Fabrication; Job shop scheduling; Manufacturing industries; Orbital robotics; Robots; Semiconductor device manufacture; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference, 2008. WSC 2008. Winter
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-2707-9
Electronic_ISBN
978-1-4244-2708-6
Type
conf
DOI
10.1109/WSC.2008.4736310
Filename
4736310
Link To Document