Title :
The effect of functionalized silver on properties of conductive adhesives
Author :
Fan, Qiong ; Cui, Huiwang ; Li, Dongsheng ; Hu, Zhili ; Yuan, Zhichao ; Ye, Lilei ; Liu, Johan
Author_Institution :
Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China
Abstract :
This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.
Keywords :
adhesives; adsorption; chemisorption; composite materials; electrical conductivity; electrical resistivity; resins; silver; viscosity; Ag; adsorbed molecule; bulk resistivity; chemisorptions; conductive adhesives; electrical conductivity; functionalized silver; isotropic conductive adhesives; low molecular organic functionalizers; low molecular surface modifiers; organic resin; shear viscosity; silver flakes; silver surface; Conductive adhesives; Conductivity; Curing; Dispersion; Resins; Silver; Viscosity;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066868
