DocumentCode :
2184469
Title :
Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives
Author :
Li, Dongsheng ; Cui, Huiwang ; Fan, Qiong ; Duan, Yajun ; Yuan, Zhichao ; Ye, Lilei ; Liu, Johan
Author_Institution :
Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
6
Abstract :
Isotropic conductive adhesives (ICAs) with stable contact resistance and high thermal conductivity are highly desirable. In this paper, a new ICA filled with silver fillers and single-wall carbon nanotubes (SCNTs) was developed. SCNTs were acidified in a mixture of 98% H2SO4 and 68% HNO3 with a volume rate of 3:1 at 50 °C for 3 h. Carboxyl and hydroxyl groups were produced on SCNTs, and the purity of SCNTs also greatly improved. To prepare the ICAs, acidified SCNTs were firstly ultrasonically dispersed in acetone, then added into the matrix resin, and finally mixed with silver fillers. The bulk resistivity of the fabricated ICAs filled with silver fillers and acidified SCNTs was larger, their lap shear strength lower, their contact resistance stability improved, and their moisture absorption remained almost unchanged. In the curing process, the released heat was greatly reduced and transferred to the surroundings for good thermal conductivity of SCNTs, but the curing temperature was not affected. Therefore, acidified SCNTs can be used in ICAs, and in general, will create a good effect on ICAs.
Keywords :
carbon nanotubes; conductive adhesives; contact resistance; curing; electrical resistivity; electronics packaging; shear strength; silver; sorption; thermal conductivity; Ag; C; bulk resistivity; carboxyl group; contact resistance stability; curing temperature; hydroxyl group; isotropic conductive adhesives; lap shear strength; matrix resin; moisture absorption; silver fillers; single-wall carbon nanotubes; temperature 50 degC; thermal conductivity; time 3 h; Absorption; Conductivity; Contact resistance; Curing; Mechanical factors; Moisture; Silver; ICAs; SCNTs; electrical properties; mechanical properties; thermal and humid properties;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066870
Filename :
6066870
Link To Document :
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