Thermal performance of high power LED package based on LTCC

Author

Ma, Mingsheng ; Liu, Zhifu ; Li, Yongxiang

Author_Institution

Key Lab. of Inorg. Functional Mater. & Devices, Shanghai, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

A novel 3D model of LTCC based high power LED package which reduced the package thermal resistance is established. It has quite low junction temperature and thermal resistance Rj-b is only 2.42°C/W. The analysis results reveal that the effect of copper volume and distribution in LTCC board plays a critical role in the heat dissipation of the LED package. Horizontal heat dissipation is also very important except for vertical thermal via. This work demonstrated that High performance LED package based on LTCC substrate can be obtained by optimizing the metallization structure of LTCC substrate or improve the thermal conductivity of LTCC material.

Keywords

cooling; light emitting diodes; metallisation; thermal conductivity; thermal management (packaging); thermal resistance; LTCC 3D model; LTCC material; LTCC substrate; copper volume; high power LED package; horizontal heat dissipation; low junction temperature; metallization structure; package thermal resistance; thermal conductivity; vertical thermal via; Electronic packaging thermal management; Light emitting diodes; Substrates; Thermal conductivity; Thermal resistance; LEDs; LTCC; junction temperature; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066872

Filename

6066872