DocumentCode
2184538
Title
Simulation on Low Energy Ion Implantation into Ge and SiGe With Molecular Dynamics Method
Author
Yu, Min ; Li, Qiang ; Yang, Jie ; Qiao, Ying ; Wang, Jinyan ; Huang, Ru ; Zhang, Xing
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing
fYear
2009
fDate
27-29 May 2009
Firstpage
1
Lastpage
4
Abstract
Using binomial distribution, we have created a structure to describe Si1-xGex substrate, so ion implantation into Ge and Si1-xGex can be simulated based on Molecular dynamics method. ZBL potential is applied to describe interaction between implanted ion and target atoms. David Cai\´s electronic stopping power model is applied to calculate collision between implanted ion and electronics. The results of boron implantation into pure Ge and Si1-xGex are compared with SIMS data. The phenomenon of fluence loss due to surface sputtering and backscattering is investigated. Factors affecting range profile and fluence loss including Ge fraction and implant tilt is also presented in this paper.This electronic document is a "live" template. The various components of your paper [title, text, heads, etc.] are already defined on the style sheet, as illustrated by the portions given in this document.
Keywords
Ge-Si alloys; binomial distribution; elemental semiconductors; ion implantation; molecular dynamics method; silicon; David Cai´s electronic stopping power model; Ge; Si1-xGex; binomial distribution; ion implantation; surface backscattering; surface sputtering; Backscatter; Boron; Crystallization; Germanium silicon alloys; Implants; Ion implantation; Lattices; Microelectronics; Silicon germanium; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Computational Electronics, 2009. IWCE '09. 13th International Workshop on
Conference_Location
Beijing
Print_ISBN
978-1-4244-3925-6
Electronic_ISBN
978-1-4244-3927-0
Type
conf
DOI
10.1109/IWCE.2009.5091152
Filename
5091152
Link To Document