Influence of interfacial delamination on temperature distribution of QFN packages

Infrared thermography has become increasingly important for non-destructive testing to detect internal defections, involving delaminations, cracks and voids. In this paper, the principle of infrared thermography is presented briefly. And a finite element approach is proposed to simulate the process of infrared thermography nondestructive testing about QFN packages. By changing with the length and the thickness of the delamination and the size of uniform surface heat flux, the surface thermal characteristics of a QFN are analyzed. The simulation results can provide basis and reference for the following work to detect defects in packages by infrared thermography method.