Morphology and nanoindentation properties of intermetallic compounds in solder joints

Author

Weixu, Zhong ; Fei, Qin ; Tong, An ; Chengyan, Liu

Author_Institution

Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

6

Abstract

The growth of intermetallic compounds (IMC) at the Sn3.0Ag0.5Cu/Cu interface is investigated under aging temperature of 150°C and aging time of 100, 300 and 500 hours. The relationship between the thickness of the IMC and aging time is fitted out, and the growth law of the IMC at Sn3.0Ag0.5Cu/Cu interface under isothermal aging condition is obtained. Mechanical properties of the Cu₆Sn₅ and Cu₃Sn are obtained by a G200 nanoindentation tester. It indicates that with the Cu₆Sn₅ thickness increases, its Young´s modulus and hardness have no change. The Young´s modulus of Cu₃Sn is greater than that of Cu₆Sn₅, but the hardness of Cu₃Sn is lower than that of Cu₆Sn₅. The nanoindentation experiments of the Sn3.0Ag0.5Cu/Cu interfacial zone show that the hardness of Cu, Cu₃Sn, Cu₆Sn₅ and Sn3.0Ag0.5Cu has an order in magnitude of Cu₆Sn₅ >; Cu₃Sn >; Cu >; Sn3.0Ag0.5Cu.

Keywords

Young´s modulus; ageing; copper alloys; hardness; nanoindentation; silver alloys; solders; tin alloys; SnAgCu-Cu; Young modulus; aging temperature; aging time; hardness; interfacial zone; intermetallic compounds; isothermal aging condition; nanoindentation tester; solder joints; temperature 150 degC; time 100 hour; time 300 hour; time 500 hour; Aging; Copper; Electronics packaging; Isothermal processes; Morphology; Soldering; Young´s modulus;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066890

Filename

6066890