• DocumentCode
    2184970
  • Title

    Scheduling a multi-chip package assembly line with reentrant processes and unrelated parallel machines

  • Author

    Lee, Sang-Jin ; Lee, Tae-Eog

  • Author_Institution
    Dept. of Ind. & Syst. Eng., KAIST, Deajeon, South Korea
  • fYear
    2008
  • fDate
    7-10 Dec. 2008
  • Firstpage
    2286
  • Lastpage
    2291
  • Abstract
    A multi-chip package (MCP) consists of several chip modules in a single package. We consider a scheduling problem for assembling MCPs. In order to assemble an MCP, a lot should repeat assembly process stages such as die attach and wire bonding as many as the number of chips to be assembled. The two key process stages have many parallel machines of various types. A machine processes different types of MCP lots with significant setup times. We therefore should limit the number of setups significantly while not sacrificing the on-time delivery performance much. We propose scheduling strategies of appropriately allocating the machine capacity to products and lots depending on the production progress of products and lots. We report experimental performances of the proposed methods.
  • Keywords
    assembling; multichip modules; parallel machines; scheduling; assembly process; die attach; machine capacity; machine processes; multichip package assembly line; parallel machines; reentrant processes; scheduling strategy; wire bonding; Assembly systems; Digital cameras; Job shop scheduling; Microassembly; Modeling; Packaging machines; Parallel machines; Random access memory; Semiconductor device packaging; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference, 2008. WSC 2008. Winter
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-2707-9
  • Electronic_ISBN
    978-1-4244-2708-6
  • Type

    conf

  • DOI
    10.1109/WSC.2008.4736332
  • Filename
    4736332