Title :
Modeling and finite-element full-wave simulation of glass interposer with TGVs (through-glass-vias) for 3D packaging
Author :
Zhang, Jing ; Sun, Xiaofeng ; Daniel, Guidotti ; Yu, Daquan ; Cao, Liqiang ; Wan, Lixi
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
A glass interposer with through-glass-via (TGV) is desirable for three-dimensional system-in-package (3D SiP) integration in order to implement product miniaturization, high density, high performance and integration of different functional chips with minimal signal propagation delay. Based on microwave transmission line theory and coplanar waveguide (CPW) theory, a finite element, full-wave method was used to simulate and analyze the transmission characteristics of TGV vertical interconnections in a glass interposer. The effect of the variations in the TGVs diameter and height, as well as the effect of coupling between two TGVs in the same layer and different layers were studied. Additionally, transmission S21, return loss S11 and electric field distributions are displayed.
Keywords :
coplanar waveguides; finite element analysis; glass; integrated circuit interconnections; integrated circuit packaging; system-in-package; three-dimensional integrated circuits; transmission line theory; waveguide theory; 3D SiP; 3D packaging; CPW theory; SiO2; TGV vertical interconnections; coplanar waveguide theory; finite-element full-wave simulation; glass interposer; microwave transmission line theory; signal propagation delay; three-dimensional system-in-package; through-glass-vias; Capacitance; Coplanar waveguides; Crosstalk; Finite element methods; Glass; Silicon; Through-silicon vias;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066892
