• DocumentCode
    2185039
  • Title

    A hierarchical MCM routing using four-via routing

  • Author

    Watanabe, Takahiro ; Fujii, Tsutomu

  • Author_Institution
    Dept. of Comput. Sci. & Syst. Eng., Yamaguchi Univ., Ube, Japan
  • fYear
    1996
  • fDate
    18-21 Nov 1996
  • Firstpage
    389
  • Lastpage
    392
  • Abstract
    Recently, multichip modules (MCM) promise to be widely applied due to the advantage of multichip packaging. But, the routing problem for MCM is more difficult than those for VLSI or PCB because of the high packing density and high performance in MCM design. The problem is formulated as a general-area multilayer routing problem, and several algorithms have been proposed. Among these algorithms, a router of four-via routing proposed by Khoo and Cong (see IEEE Trans. CAD, vol.14, no.10, p.1277-90, 1995), named V4R, is the most efficient. V4R routes each net using no more than four interconnection vias, and it can make a better routing result than other MCM routers. However, there are some unresolved issues; for example, nets are routed in order of their terminal positions, so that more routing layers may be required even for short-length nets, or some routing layers are more congested because as many nets as possible are routed on the routing layers under consideration. In this paper, we present a hierarchical routing approach combined with V4R, aiming to improve the above-mentioned issues but also to preserve the characteristics of four-via routing and efficiency of V4R. In our proposed method, first, a routing area is divided into subareas hierarchically and then V4R is repeatedly applied in each subarea in the bottom-up way. Experimental results show that our approach is fairly good in the total routing-length compared with V4R itself
  • Keywords
    circuit layout CAD; multichip modules; network routing; V4R router; four-via routing; general-area multilayer routing problem; hierarchical MCM routing; high packing density; multichip modules; Bipartite graph; Circuit topology; Multichip modules; Nonhomogeneous media; Packaging; Pins; Routing; Very large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1996., IEEE Asia Pacific Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    0-7803-3702-6
  • Type

    conf

  • DOI
    10.1109/APCAS.1996.569297
  • Filename
    569297