• DocumentCode
    2185047
  • Title

    An overview of modeling and simulation for lab-on-a-chip applications

  • Author

    Catarino, S.O. ; Minas, Graca ; Miranda, J.M. ; Lanceros-Mendez, S.

  • Author_Institution
    Centro Algoritmi, Univ. of Minho, Guimaraes, Portugal
  • fYear
    2013
  • fDate
    20-23 Feb. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The research team has been focused, in the last years, on lab-on-a-chip devices for clinical applications, where the acoustic streaming technique is used for promoting the mixing, the pumping and the chemical reactions of fluids inside the microstructures. This paper describes an overview of the advances achieved by the group in the modeling and simulation areas. In particular, it is focused the modeling and simulation of the acoustic streaming generated by a piezoelectric transducer: poly(vinylidene fluoride) - PVDF. The modeling of the acoustic streaming phenomenon includes the study of the piezoelectric effect generated by the transducers, the compressible Navier-Stokes equations and the heat transfer equations. The numerical results validate the experimental results previously achieved by the team and may represent a potential breakthrough in microfluids mixing.
  • Keywords
    Navier-Stokes equations; acoustic streaming; bioMEMS; heat transfer; lab-on-a-chip; microchannel flow; mixing; piezoelectric transducers; PVDF; acoustic streaming; chemical reactions; clinical applications; compressible Navier-Stokes equations; fluids; heat transfer equations; lab-on-a-chip applications; microchannel; microfluids mixing; microstructures; piezoelectric transducer; poly(vinylidene fluoride); pumping; Damping; Gold; Heating; Solid modeling; Transducers; Viscosity; acoustic streaming; heat transfer; microfluidics; modeling and simulation; piezoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioengineering (ENBENG), 2013 IEEE 3rd Portuguese Meeting in
  • Conference_Location
    Braga
  • Print_ISBN
    978-1-4673-4859-1
  • Type

    conf

  • DOI
    10.1109/ENBENG.2013.6518397
  • Filename
    6518397