Title :
Fast and flexible development of multichip modules for space and other high-reliability applications
Author :
Banker, Jeffrey ; Buckingham, Jeremy ; Caffrey, Robert ; Garrison, Ann ; Shaw, Harry
Author_Institution :
Pico Syst. Inc., Toledo, OH, USA
Abstract :
Pico Systems, Inc. And NASA-Goddard Space Flight Center have been working together to determine the viability of Pico´s programmable multichip module (MCM) substrate for use in space and high reliability applications. This paper will describe the technology Pico has developed, how it is relevant to high reliability applications, the results of the testing performed, and examples of how Pico´s substrates have been used in high reliability applications
Keywords :
aerospace testing; integrated circuit reliability; integrated circuit testing; multichip modules; space vehicle electronics; NASA-Goddard Space Flight Center; Pico Systems; high-reliability applications; multichip modules; space applications; testing; Aluminum; Assembly; Field programmable gate arrays; Multichip modules; NASA; Sea surface; Space technology; Substrates; Surface topography; Wire;
Conference_Titel :
Digital Avionics Systems Conference, 1997. 16th DASC., AIAA/IEEE
Conference_Location :
Irvine, CA
Print_ISBN :
0-7803-4150-3
DOI :
10.1109/DASC.1997.635025
