DocumentCode
2185096
Title
Fast and flexible development of multichip modules for space and other high-reliability applications
Author
Banker, Jeffrey ; Buckingham, Jeremy ; Caffrey, Robert ; Garrison, Ann ; Shaw, Harry
Author_Institution
Pico Syst. Inc., Toledo, OH, USA
Volume
1
fYear
1997
fDate
26-30 Oct 1997
Firstpage
2.1
Abstract
Pico Systems, Inc. And NASA-Goddard Space Flight Center have been working together to determine the viability of Pico´s programmable multichip module (MCM) substrate for use in space and high reliability applications. This paper will describe the technology Pico has developed, how it is relevant to high reliability applications, the results of the testing performed, and examples of how Pico´s substrates have been used in high reliability applications
Keywords
aerospace testing; integrated circuit reliability; integrated circuit testing; multichip modules; space vehicle electronics; NASA-Goddard Space Flight Center; Pico Systems; high-reliability applications; multichip modules; space applications; testing; Aluminum; Assembly; Field programmable gate arrays; Multichip modules; NASA; Sea surface; Space technology; Substrates; Surface topography; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital Avionics Systems Conference, 1997. 16th DASC., AIAA/IEEE
Conference_Location
Irvine, CA
Print_ISBN
0-7803-4150-3
Type
conf
DOI
10.1109/DASC.1997.635025
Filename
635025
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