DocumentCode :
2185412
Title :
Main cause of resonance appeared around 7.5GHz on the frequency response of S-parameters of PWB
Author :
Yong, Zhang Nian ; Chuan, Men ; Kawai, Takeshi ; Wei, Ren ; Qing, Wu Xiao ; Futamura, Hirofumi ; Goto, Nobumichi ; YouHong, Wu ; Yamashita, Takahiro
Author_Institution :
Electron. Mater. Res. Lab., Xi´´an Jiaotong Univ., Xian, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
5
Abstract :
Hardware engineers engaging in the mobile system pursue lower power, less weight and higher performance by minimizing the main factors impacting the Printed-Wiring-Board (PWB) performance which involve a large number of discontinuities. It happens to meet the abnormal phenomenon like a resonance, even in the PWB comprised of only the transmission lines connected one after another in series with via-junctions of 10. However it is not encountered in a case connected by a few via-junctions, and the field solver used ordinarily for checking the abnormality would not predict it. The main cause of the resonance appeared around 7.5 GHz on the frequency response of the S-parameters of the PWB with plural transmission lines connected one after another in series by the via-junctions was investigated by the network analyzer and an equivalent circuit model. And the characteristic impedance mismatches among the transmission lines was found out to be the main factor for this phenomenon.
Keywords :
S-parameters; equivalent circuits; frequency response; high-frequency transmission lines; impedance matching; mobile radio; network analysers; printed circuits; PWB performance; S-parameters; characteristic impedance mismatches; equivalent circuit model; frequency response; hardware engineers; mobile system; network analyzer; plural transmission lines; printed-wiring-board performance; Analytical models; Equivalent circuits; Impedance; Integrated circuit modeling; Junctions; Power transmission lines; Transmission line measurements; Discontinuity in PWB; Equivalent circuit model; Resonance; S-parameters; Transmission line; Via-junction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066909
Filename :
6066909
Link To Document :
بازگشت