Complete small signal equivalent circuit model of 10Gb/s TOSA package EML module

Author

Xu, Chengzhi ; Lu, Kunzhong ; Liu, Weihua ; Fan, Shibing ; Xu, Y.Z.

Author_Institution

Wuhan Nat. Lab. for Optoelectron., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

3

Abstract

A complete high frequency small signal equivalent circuit model of 10Gb/s TOSA package of Electroabsorption Modulator integrated Laser(EML) is presented. The model includes submount, bonding wires, flexible printed circuit (FPC), and EML chip. The values of each component parameters are extracted by the method of curve fitting. A good agreement between measured and simulated results confirms the accuracy and valid the procedures. It is expected that the low-cost TOSA packaged EML module and good E/O response characteristic can be achieved using the proposed model.

Keywords

curve fitting; distributed feedback lasers; electroabsorption; electronics packaging; equivalent circuits; modules; optical modulation; printed circuits; semiconductor lasers; E/O response characteristic; EML chip; TOSA package EML module; bit rate 10 Gbit/s; bonding wires; curve fitting method; distributed feedback laser; electroabsorption modulator integrated laser; flexible printed circuit; high frequency small signal equivalent circuit model; Equivalent circuits; Frequency measurement; Integrated circuit modeling; Modulation; Resistance; Semiconductor lasers; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066910

Filename

6066910